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Ping, Power & Processors: Announcing our Acquisition by Equinix. Read more on our blog.

Overview

Packet’s network and datacenter topology is designed with performance and redundancy as top priorities. Two unique features include a Layer-3 topology and native dual-stack (IPv4 / IPv6) capability.

With our Layer-3 network design, each server is directly attached to a physical switch via either 2 x 1Gbps copper or 2 x 10Gbps SFP+ connections. This provides elastic, cloud-style networking without the slow, latency-inducing characteristics often associated with complex overlays. For use cases that require Layer 2 functionality, please check out our Layer 2 feature.

For redundancy, each server has dedicated dual network connections going into two Top-of-Rack (ToR) switches. These two physical connections are virtually bonded together as follows:

Type Network
t1.small 2.5 Gbps Network (2 × Intel NICs 2.5Gbps w/ TLB) full hardware redundancy but no active/active bond.
c1.small 2 Gbps Bonded Network (2 × Intel NICs 1Gbps w/ LACP) full hardware redundancy and active/active bond.
x1.small 10 Gbps Network (2 x Intel X710 NICs 10 Gbps w/ TLB) full hardware redundancy but no active/active bond.
m1.xlarge 20 Gbps Bonded Network (2 × Mellanox ConnectX NICs, 10Gbps w/ LACP) full hardware redundancy and active/active bond.
c1.xlarge 20 Gbps Bonded Network (2 × Mellanox ConnectX NICs, 10Gbps w/ LACP) full hardware redundancy and active/active bond.
s1.large 20 Gbps Bonded Network ( 2 × Mellanox ConnectX NICs, 10 Gbps w/ LACP) full hardware redundancy and active/active bond.
m2.xlarge 20Gbps Network Pipe with 2 x 10 Gbps Bonded NICs in an HA configuration (2 x 10Gbps Mellanox Connect-X 4 NICs)
c2.medium 20Gbps Network Pipe with 2 x 10 Gbps Bonded NICs in an HA configuration (2 x Mellanox ConnectX NICs)
g2.large 20Gbps Bonded Network 2 × 10GBPS W/ LACP
n2.large Quad-port Intel x710 (4 × 10GBPS W/ LACP)